The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jun. 09, 2015
Applicant:

Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;

Inventors:

Makoto Yasuda, Kuwana, JP;

Taiji Ema, Inabe, JP;

Mitsuaki Hori, Kuwana, JP;

Kazushi Fujita, Kuwana, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/11546 (2017.01); H01L 29/66 (2006.01); H01L 21/66 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/10 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11546 (2013.01); H01L 21/28273 (2013.01); H01L 21/84 (2013.01); H01L 22/20 (2013.01); H01L 27/1203 (2013.01); H01L 29/105 (2013.01); H01L 29/42324 (2013.01); H01L 29/66575 (2013.01); H01L 29/66825 (2013.01); H01L 21/26506 (2013.01); H01L 21/26513 (2013.01); H01L 22/12 (2013.01);
Abstract

A semiconductor device manufacturing method includes forming a silicon layer by epitaxial growth over a semiconductor substrate having a first area and a second area; forming a first gate oxide film by oxidizing the silicon layer; removing the first gate oxide film from the second area, while maintaining the first gate oxide film in the first area; thereafter, increasing a thickness of the first gate oxide film in the first area and simultaneously forming a second gate oxide film by oxidizing the silicon layer in the second area; and forming a first gate electrode and a second gate electrode over the first gate oxide film and the second gate oxide film, respectively, wherein after the formation of the first and second gate electrodes, the silicon layer in the first area is thicker than the silicon layer in the second area.


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