The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Aug. 25, 2015
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Yuya Takano, Nishio, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H01L 23/473 (2006.01); H01L 25/11 (2006.01); H01L 21/48 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4882 (2013.01); H01L 23/40 (2013.01); H01L 25/117 (2013.01); H01L 23/3675 (2013.01); H01L 2225/1076 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a stacked unit having a semiconductor module, a first cooler having a first opening and a first coolant flow path that is connected to the first opening, and a second cooler that has a second opening and a second coolant flow path that is connected to the second opening, and being formed by the first cooler and the second cooler sandwiching the semiconductor module and being stacked such that the first opening and the second opening face each other; a seal member that is arranged between the first opening and the second opening that are adjacent in a stacking direction, and that connect the first opening and the second opening; and a winding member that keeps pressure applied to the stacked unit in the stacking direction by being wound around the stacked unit.


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