The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Apr. 20, 2016
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C09D 179/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); C09D 161/06 (2006.01); C09D 179/04 (2006.01); C08L 61/06 (2006.01); C08L 79/04 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); C08G 8/04 (2006.01); C08G 73/06 (2006.01); C08G 77/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08L 61/06 (2013.01); C08L 79/04 (2013.01); C09D 161/06 (2013.01); C09D 179/00 (2013.01); C09D 179/04 (2013.01); H01L 23/296 (2013.01); H01L 23/3107 (2013.01); H01L 23/49582 (2013.01); C08G 8/04 (2013.01); C08G 73/0655 (2013.01); C08G 77/50 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01);
Abstract
Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.