The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jan. 29, 2013
Applicant:
Altera Corporation, San Jose, CA (US);
Inventors:
Shuxian Chen, Fremont, CA (US);
Jeffrey T. Watt, Palo Alto, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/52 (2006.01); H01L 25/18 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5286 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17181 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal.