The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Aug. 17, 2012
Applicants:

Kaoru Hatano, Kanagawa, JP;

Yusuke Nishido, Kanagawa, JP;

Shunpei Yamazaki, Tokyo, JP;

Inventors:

Kaoru Hatano, Kanagawa, JP;

Yusuke Nishido, Kanagawa, JP;

Shunpei Yamazaki, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 27/32 (2006.01); H01L 33/00 (2010.01); H01L 21/50 (2006.01); H01L 51/52 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 27/3276 (2013.01); H01L 51/5246 (2013.01); H01L 23/10 (2013.01); H01L 27/3279 (2013.01); H01L 2924/0002 (2013.01);
Abstract

To provide a highly reliable light-emitting device with less occurrence of cracks in a sealant bonding two facing substrates together. In a light-emitting device, a first substrate including a light-emitting unit, and a second substrate are bonded to each other with glass frit. A wiring in the area overlapping with a sealing material formed by melting and solidifying glass frit may be formed of a conductive material having a linear thermal expansion coefficient close to that of a substrate material. More specifically, the difference in the linear thermal expansion coefficient between the conductive material and the substrate material is 5 ppm/K or less at a temperature of 0° C. to 500° C.


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