The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

May. 18, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Byron J R Shulver, Kilmacolm, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/5227 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 23/645 (2013.01); H01L 43/12 (2013.01);
Abstract

A microelectronic device is formed by forming a stack of alternating layers of a magnetic material and a dielectric material. An etch mask is formed over the magnetic laminate layer. An aqueous wet etch including 5 percent to 10 percent nitric acid, 0.5 percent to 2 percent sulphuric acid, and 0.5 percent to 3 percent hydrofluoric acid is used to etch the magnetic laminate layer where exposed by the etch mask to form a patterned magnetic laminate layer. An optional adhesion layer, if present, is also removed by the aqueous wet etch solution where exposed by the etch mask. The etch mask is subsequently removed.


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