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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9633848 B1

PDFFull Text
Date of Patent:
Apr. 25, 2017

Filed:

Oct. 09, 2013

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Yu Aoki, Hitachi, JP;

Shigeru Nobe, Hitachi, JP;

Hiroshi Matsutani, Tsukuba, JP;

Kei Kasuya, Hitachi, JP;

Akitoshi Tanimoto, Hitachi, JP;

Shingo Tahara, Hitachi, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Martin Angerbranndt

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); C09D 125/18 (2006.01); C08F 8/12 (2006.01); C08F 12/24 (2006.01); C08F 220/34 (2006.01); C08F 220/36 (2006.01); H01L 51/00 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); C08F 212/14 (2006.01); C08F 12/22 (2006.01); C08F 112/14 (2006.01); C08L 25/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); C08F 8/12 (2013.01); C08F 12/22 (2013.01); C08F 112/14 (2013.01); C08F 212/14 (2013.01); C08L 25/18 (2013.01); C09D 125/18 (2013.01); G03F 7/0233 (2013.01); G03F 7/038 (2013.01); G03F 7/0388 (2013.01); G03F 7/40 (2013.01); H01L 21/02118 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 23/5329 (2013.01); H01L 24/13 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05099 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73104 (2013.01);
Abstract

Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein Rrepresents a hydrogen atom or a methyl group; and Rrepresents a hydroxyalkyl group having 2 to 20 carbon atoms.

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