The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jul. 14, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Tomoyuki Ashimine, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/02 (2006.01); H01G 7/06 (2006.01); C23C 14/20 (2006.01); H01C 7/00 (2006.01); H01L 21/822 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 27/04 (2006.01); C23C 14/58 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01G 7/06 (2013.01); C23C 14/20 (2013.01); C23C 14/5806 (2013.01); H01C 7/00 (2013.01); H01L 21/768 (2013.01); H01L 21/822 (2013.01); H01L 23/49822 (2013.01); H01L 23/522 (2013.01); H01L 23/5228 (2013.01); H01L 27/04 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electronic component that includes a resistive element. A Ni concentration of a resistive thin film of the resistive element at a side where there is a connection interface with a connection electrode is higher than the concentration of Ni at the side opposite to the interface.


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