The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jun. 09, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Masaru Takahashi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/06 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H05K 3/34 (2006.01); H01G 4/12 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/06 (2013.01); H01G 2/065 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H05K 3/3442 (2013.01); H01G 4/12 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); Y02P 70/613 (2015.11);
Abstract

A mounted structure includes a laminated capacitor, a wiring substrate, and a joint material. The laminated capacitor includes a body with dielectric layers and internal electrode layers alternately stacked, and an external electrode connected to the internal electrode layers. The body includes a side surface coated with a side surface coating portion of the external electrode. The joint material is joined to the side surface coating portion and a land provided on the wiring substrate so as to cover the outer surfaces thereof. The outer end portion of the thickest portion of the joint material covering the side surface coating portion is located farther outside an outer end of the land in a direction perpendicular or substantially perpendicular to a side surface of the body.


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