The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Dec. 17, 2015
Applicant:

Toppan Printing Co., Ltd., Taito-ku, Tokyo, JP;

Inventors:

Shonosuke Mizoguchi, Tokyo, JP;

Tetsuya Tsukada, Tokyo, JP;

Eriko Hatakeyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); G06K 19/077 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07747 (2013.01); G06K 19/07775 (2013.01); G06K 19/07779 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49827 (2013.01); H01L 23/49855 (2013.01); H01L 23/5227 (2013.01); H01L 24/43 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 24/45 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract

An IC module of the present invention includes: a sheet-like base having a first surface and a second surface and having a first through hole and a second through hole spaced apart from the first through hole; an IC chip provided to the first surface, having a contact communication function and a contactless communication function, and having two terminals formed thereon; a connecting coil formed on the first surface and having two ends; a contact terminal portion provided to the second surface and configured to contact an external contact machine; bridge wiring provided to the second surface, provided at a position overlapping with the first and second through holes, and electrically insulated from the contact terminal portion; a first conductive wire inserted through the first through hole and connecting the first terminal of the IC chip to the bridge wiring; a second conductive wire inserted through the second through hole and connecting the bridge wiring to the first end of the connecting coil; and a third conductive wire connecting the second end of the connecting coil to the second terminal of the IC chip.


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