The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Aug. 14, 2013
Applicant:

Honda Motor Co. Ltd., Tokyo, JP;

Inventors:

Shigeto Akahori, Tochigi, JP;

Shinyu Hirayama, Tochigi, JP;

Hiroyuki Yamagishi, Tochigi, JP;

Yoko Yamaji, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06794 (2013.01); G01R 31/2886 (2013.01);
Abstract

A semiconductor inspection device () equipped with a contacting unit () having a contacting side surface () electrically contacting a semiconductor element (), and which inspects the semiconductor element () by making the contacting unit () electrically contact the semiconductor element (). The contacting side surface () is provided with a plurality of projecting units (), and the semiconductor element inspection device () is equipped with a hitting mark detecting unit () configured to detect hitting marks of the projecting unit () transferred to the semiconductor element () when the contacting side surface () contacts the semiconductor element (), and a control unit () configured to determine whether or not an inspection of the semiconductor element () is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit ().


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