The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Oct. 27, 2009
Applicants:

Tobias Mieth, Dresden, DE;

Sven-matthias Scheibe, Dresden, DE;

Inventors:

Tobias Mieth, Dresden, DE;

Sven-Matthias Scheibe, Dresden, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 19/22 (2006.01); G01N 27/28 (2006.01);
U.S. Cl.
CPC ...
G01N 27/286 (2013.01);
Abstract

A sensor module includes a sensor element with a transducer for emitting an electric analog primary signal, which depends on a measured value; and a circuit assembly for conditioning the primary signal and for unidirectional data communication of a digital signal, which depends on the primary signal, to a superordinated unit. The circuit assembly has the following components: a signal input for receiving the primary signal, which depends on the measured value; a secondary side, inductively coupling, plug connector element for connection to a primary side, inductively coupling, plug connector element of the superordinated unit for receiving an energy signal and for transferring a measurement signal; an energy supply circuit, which rectifies the energy signal and provides at least one direct voltage for supplying the sensor module components; an analog signal conditioning circuit for conditioning the primary signal to a secondary signal; an analog-digital converter for converting the secondary signal to a digital measurement signal; a modulator for modulating the received energy signal for transferring the measurement signal to a superordinated unit by means of load modulation; and a microcontroller for controlling the components of the circuit assembly.


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