The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Nov. 17, 2015
Applicant:

Longwide Technology Inc., Nantou County, TW;

Inventors:

Huan-Jan Chien, Hsinchu County, TW;

Tsung-Hong Tsai, Nantou County, TW;

Assignee:

LONGWIDE TECHNOLOGY INC., Nantou County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21V 21/00 (2006.01); F21V 15/01 (2006.01); H05K 3/20 (2006.01); F21V 29/77 (2015.01); F21V 23/00 (2015.01); F21K 9/232 (2016.01); H05K 1/18 (2006.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01); F21Y 107/20 (2016.01); F21Y 113/13 (2016.01); F21Y 113/17 (2016.01);
U.S. Cl.
CPC ...
F21V 21/00 (2013.01); F21K 9/232 (2016.08); F21V 15/01 (2013.01); F21V 23/001 (2013.01); F21V 29/773 (2015.01); H05K 1/181 (2013.01); H05K 3/202 (2013.01); F21Y 2101/00 (2013.01); F21Y 2107/20 (2016.08); F21Y 2113/13 (2016.08); F21Y 2113/17 (2016.08); F21Y 2115/10 (2016.08); H05K 1/189 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.


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