The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Nov. 08, 2012
Applicant:

Citizen Holdings Co., Ltd., Tokyo, JP;

Inventors:

Masafumi Ide, Saitama, JP;

Kaoru Yoda, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21K 2/00 (2006.01); F21K 99/00 (2016.01); G02B 6/42 (2006.01); H01S 5/022 (2006.01); G02B 6/122 (2006.01); G02F 1/01 (2006.01); F21K 9/64 (2016.01); H01S 5/00 (2006.01); H01S 5/40 (2006.01); F21Y 101/00 (2016.01); F21Y 115/30 (2016.01);
U.S. Cl.
CPC ...
F21K 9/56 (2013.01); F21K 9/64 (2016.08); G02B 6/122 (2013.01); G02B 6/4239 (2013.01); G02F 1/0147 (2013.01); H01S 5/02248 (2013.01); F21Y 2101/00 (2013.01); F21Y 2115/30 (2016.08); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01S 5/0092 (2013.01); H01S 5/4093 (2013.01);
Abstract

The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.


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