The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jan. 08, 2015
Applicant:

Duraflex Hong Kong Limited, Hong Kong, HK;

Inventor:

Te Chien Chen, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 15/24 (2006.01); B29L 5/00 (2006.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
B23P 15/24 (2013.01); B29C 33/42 (2013.01); B29L 2005/00 (2013.01); Y10T 29/49996 (2015.01);
Abstract

A method for producing a single-sided mold and a double-sided coining mold are provided. The method comprises the following steps: S1. forming a mold cavity on the single-sided mold according to shape of a product; S2. engraving a surface of the mold cavity by a first engraving and milling cutter to form engraved holes, and then inserting a second engraving and milling cutter into the engraved holes for further engraving to form holes to be coined; S3. repeating the step S2 until a predefined number of the holes to be coined are formed on the surface of the mold cavity; S4. placing a coining die with hardened tips on the surface of the mold cavity, and embedding each of the hardened tips into one of the holes to be coined respectively, and then the mold cavity being molded by a coining process.


Find Patent Forward Citations

Loading…