The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Dec. 04, 2013
Applicant:

Leidos Innovations Technology, Inc., Gaithersburg, MD (US);

Inventors:

Michael Edward Egan, Bothell, WA (US);

Peter Karl Trost, San Diego, CA (US);

James Landers, Charlottesville, VA (US);

Brian Root, Charlottesville, VA (US);

Orion Scott, Charlottesville, VA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 7/00 (2006.01); C12Q 1/68 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 7/52 (2013.01); B01L 3/5027 (2013.01); C12Q 1/686 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0627 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/1822 (2013.01); B01L 2300/1844 (2013.01); B01L 2300/1872 (2013.01); B01L 2300/1894 (2013.01);
Abstract

A microfluidic chip includes one or more reaction chambers to hold fluids for chemical or biochemical reactions, such as PCR. A non-contact heat source heats the reaction chamber and the fluid, such that the heat source does not contact the reaction chamber or the fluid. The heat source can heat the reaction chamber and the fluid separately, where the reaction chamber and the fluid separately absorb heat radiation from the heat source. A temperature sensor acquires a temperature of the reaction chamber and/or the fluid. Control circuitry controls the heat source according to a cycling profile for the reaction in the fluid to cycle the heat source between heating and not heating the reaction chamber and the fluid based on the temperature acquired by the temperature sensor. Cooling can be provided passively or actively.


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