The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jul. 03, 2013
Applicants:

Abhishek Roy, Edina, MN (US);

Tina L. Arrowood, Elko New Market, MN (US);

Anand S. Badami, Midland, MI (US);

Robert C. Cieslinski, Midland, MI (US);

David D. Hawn, Midland, MI (US);

Steven D. Jons, Eden Prairie, MN (US);

Mou Paul, Edina, MN (US);

Steven Rosenberg, Shorewood, MN (US);

Huang Wu, Midland, MI (US);

Inventors:

Abhishek Roy, Edina, MN (US);

Tina L. Arrowood, Elko New Market, MN (US);

Anand S. Badami, Midland, MI (US);

Robert C. Cieslinski, Midland, MI (US);

David D. Hawn, Midland, MI (US);

Steven D. Jons, Eden Prairie, MN (US);

Mou Paul, Edina, MN (US);

Steven Rosenberg, Shorewood, MN (US);

Huang Wu, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 71/56 (2006.01); B01D 39/14 (2006.01); B01D 29/00 (2006.01); B05D 5/00 (2006.01); B01D 67/00 (2006.01); B01D 69/12 (2006.01); B01D 61/02 (2006.01); B01D 69/10 (2006.01);
U.S. Cl.
CPC ...
B01D 67/0006 (2013.01); B01D 61/025 (2013.01); B01D 67/0002 (2013.01); B01D 69/10 (2013.01); B01D 69/12 (2013.01); B01D 69/125 (2013.01); B01D 71/56 (2013.01); B01D 2323/00 (2013.01); B01D 2323/38 (2013.01); B01D 2323/40 (2013.01); B01D 2325/20 (2013.01);
Abstract

A thin film composite polyamide membrane having a porous support and a thin film polyamide layer comprising a reaction product of m-phenylene diamine (mPD) and trimesoyl chloride (TMC), characterized by the thin film polyamide layer having a critical strain value of less than 10%. In another embodiment, the thin film polyamide layer has a modulus of greater than 0.75 (GPa). In yet another embodiment, the thin film polyamide layer has an equilibrium swelling value of at least 45%. In another embodiment, the thin film polyamide layer has a thickness of at least 230 nm.


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