The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Nov. 01, 2016
Applicant:

OK International Inc., Cypress, CA (US);

Inventors:

Kenneth D. Marino, Long Beach, CA (US);

Hoa Nguyen, Santa Ana, CA (US);

Assignee:

OK INTERNATIONAL, INC., Cypress, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 3/02 (2006.01); B23K 31/02 (2006.01); H05K 13/08 (2006.01); B23K 3/03 (2006.01); B23K 3/08 (2006.01); G01N 21/27 (2006.01); G01K 7/16 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); B23K 3/033 (2013.01); B23K 3/08 (2013.01); G01K 7/16 (2013.01); G01N 21/27 (2013.01);
Abstract

A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.


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