The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Dec. 10, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

John Eric Kunz, Jr., Allen, TX (US);

Jonathan Scott Brodsky, Richardson, TX (US);

Gianluca Boselli, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); H05K 13/08 (2006.01); H01L 21/66 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); G01R 31/001 (2013.01); H01L 22/34 (2013.01); H01L 27/0292 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); Y10T 29/49004 (2015.01);
Abstract

An ESD monitor device may take the form of an integrated circuit with a plurality of monitor components available at each I/O site of the ESD monitor device. Each monitor component has a physical structure which provides scalable ESD robustness. The monitor components are connected in parallel to an ESD bus. An integrated circuit may be formed by processing an ESD monitor device through one or more process steps of an integrated circuit manufacturing line, and subsequently measuring the ESD monitor device. Parameters of a process step of the manufacturing line may be adjusted to reduce ESD events at the process step, based on measurement results from the ESD monitor device. The integrated circuit may subsequently be processed through the adjusted process step.


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