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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9629282 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Apr. 11, 2012

Electronic device, structure, and heat sink

Applicants:

Yoshiaki Kasahara, Tokyo, JP;

Hiroshi Toyao, Tokyo, JP;

Inventors:

Yoshiaki Kasahara, Tokyo, JP;

Hiroshi Toyao, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:

Wilmer Cutler Pickering Hale and Dorr LP

Primary Examiner:

Tuan T Dinh

Assistant Examiner:

Mukund G Patel

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01P 1/20 (2006.01); H01L 23/36 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 23/552 (2013.01); H01P 1/2005 (2013.01); H05K 1/0236 (2013.01); H01L 23/3672 (2013.01); H01L 23/64 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0203 (2013.01);
Abstract

An electronic device includes a substrate (), a conductor plane () which is provided on an inner layer of the substrate (), an electronic circuit () which is mounted on the substrate (), a heat sink () which is mounted on an upper surface of the electronic circuit (), includes a portion which does not overlap with the electronic circuit () when seen in a plan view, faces the conductor plane (), and is configured of a conductive material, a conductor via () which is connected to the heat sink () on a surface of the heat sink () contacting the electronic circuit (), and extends toward the conductor plane (), and a stub () which is connected to the conductor via () and extends to face the conductor plane ().

Find Patent Forward Citations

Kasahara, Yoshiaki. (2017). Electronic device, structure, and heat sink (U.S. Patent No. 9629282). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9629282

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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