The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Jan. 30, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/426 (2013.01); H05K 3/108 (2013.01); H05K 1/036 (2013.01); H05K 3/285 (2013.01); H05K 2201/0959 (2013.01); H05K 2203/1476 (2013.01);
Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.