The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Feb. 04, 2015
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H05K 1/184 (2013.01); H05K 1/0268 (2013.01); H05K 1/188 (2013.01); H05K 3/4626 (2013.01); H05K 3/4697 (2013.01); H01L 21/568 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 27/14618 (2013.01); H01L 2224/04105 (2013.01); H05K 3/0035 (2013.01); H05K 3/0047 (2013.01); H05K 3/025 (2013.01); H05K 3/282 (2013.01); H05K 2201/068 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1383 (2013.01); H05K 2203/1388 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/162 (2013.01);
Abstract
Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.