The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Jul. 28, 2015
Infineon Technologies Ag, Neubiberg, DE;
Qianli Mu, San Jose, CA (US);
Cristian Gozzi, Santa Clara, CA (US);
Michael Simcoe, S. San Francisco, CA (US);
Guillaume Bigny, San Jose, CA (US);
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a metal baseplate, a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate. The multilayer circuit board includes a plurality of interleaved signal and ground layers. One of the signal layers is at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die. One of the ground layers is at the first side of the multilayer circuit board and attached to the metal baseplate. Power distribution structures are formed in the signal layer at the second side of the multilayer circuit board. RF matching structures are formed in a different one of the signal layers than the power distribution structures.