The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Dec. 27, 2012
Applicant:

Zeon Corporation, Tokyo, JP;

Inventors:

Yuuki Hayashi, Tokyo, JP;

Takashi Iga, Tokyo, JP;

Assignee:

ZEON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/28 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); B32B 37/24 (2006.01); B32B 38/08 (2006.01); H05K 3/00 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 5/28 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 37/24 (2013.01); B32B 38/08 (2013.01); C08J 5/24 (2013.01); H05K 3/007 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2307/73 (2013.01); C08K 3/36 (2013.01); Y10T 156/10 (2015.01); Y10T 428/2495 (2015.01);
Abstract

A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.


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