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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9629239 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Mar. 05, 2012

Resin composition, and prepreg as well as laminate using the same

Applicants:

Hajime Ohtsuka, Kamisu, JP;

Daisuke Ueyama, Tokyo, JP;

Masanobu Sogame, Tokyo, JP;

Inventors:

Hajime Ohtsuka, Kamisu, JP;

Daisuke Ueyama, Tokyo, JP;

Masanobu Sogame, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
H05K 1/03 (2006.01); C08G 59/40 (2006.01); C08K 3/00 (2006.01); H05K 1/05 (2006.01); C08J 5/24 (2006.01); B32B 15/092 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); C08K 9/02 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); C08G 59/4014 (2013.01); C08J 5/24 (2013.01); C08K 3/0033 (2013.01); C08K 3/38 (2013.01); C08K 9/02 (2013.01); H05K 1/056 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/302 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08K 2003/387 (2013.01); Y10T 428/31529 (2015.04);
Abstract

A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

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