The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Mar. 04, 2015
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jing Xie, San Diego, CA (US);

Yang Du, Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/00 (2006.01); H03K 3/037 (2006.01); H03K 19/0175 (2006.01); H01L 25/065 (2006.01); G06F 1/32 (2006.01);
U.S. Cl.
CPC ...
H03K 19/0021 (2013.01); G06F 1/3296 (2013.01); H01L 25/0657 (2013.01); H03K 3/037 (2013.01); H03K 19/017509 (2013.01);
Abstract

A three-dimensional integrated circuit having a dual or multiple power domain is capable of less energy consumption operation under a given clock rate, which results in an enhanced power-performance-area (PPA) envelope. Sequential logic operates under a system clock that determines the system throughput, whereas combinational logic operates in a different power domain to control overall system power including dynamic and static power. The sequential logic and clock network may be implemented in one tier of the three-dimensional integrated circuit supplied with a relatively high power supply voltage, whereas the combinational logic may be implemented in another tier of the three-dimensional integrated circuit supplied with a relatively low power supply voltage. Further pipeline reorganization may be implemented to leverage the system energy consumption and performance to an optimal point.


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