The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Jun. 02, 2015
Applicant:
Futurewei Technologies, Inc., Plano, TX (US);
Inventors:
Assignee:
Futurewei Technologies, Inc., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H02M 3/158 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H02M 3/00 (2006.01);
U.S. Cl.
CPC ...
H02M 3/158 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H02M 3/1588 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/14252 (2013.01); H02M 3/00 (2013.01); Y02B 70/1466 (2013.01); Y10T 29/4913 (2015.01);
Abstract
An embodiment power converter package comprises a semiconductor die, an output inductor, a plurality of input capacitors and output capacitors. The semiconductor die, the output inductor and the plurality of capacitors are mounted on a lead frame and connected one to another through various pads on the lead frame. The semiconductor die comprises a high side switch, a low side switch and a driver. The power converter package is electrically coupled to an external pulse width modulation controller through a variety of input and output pads.