The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jul. 14, 2014
Applicant:

Bae Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);

Inventors:

Kevin W. Sliech, Merrimack, NH (US);

Timothy M. Dresser, Nashua, NH (US);

Jared P. Majcher, Manchester, NH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H02B 1/56 (2006.01); H01R 4/48 (2006.01); H01R 12/52 (2011.01); H01Q 21/00 (2006.01); H02B 1/20 (2006.01);
U.S. Cl.
CPC ...
H02B 1/56 (2013.01); H01Q 21/0087 (2013.01); H01R 4/48 (2013.01); H01R 12/52 (2013.01); H02B 1/20 (2013.01); H05K 7/209 (2013.01); H05K 7/20254 (2013.01); H05K 7/20927 (2013.01); H01L 23/473 (2013.01); H05K 7/20218 (2013.01);
Abstract

A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module, a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array.


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