The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Dec. 18, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Tsunenori Shibata, Fujisawa, JP;

Yoshiyuki Maki, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/0687 (2006.01); H01S 5/022 (2006.01); H01L 27/15 (2006.01); H01L 27/18 (2006.01); H01L 27/16 (2006.01); H01L 27/22 (2006.01); H01L 27/20 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02415 (2013.01); H01S 5/0687 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 27/156 (2013.01); H01L 27/16 (2013.01); H01L 27/18 (2013.01); H01L 27/20 (2013.01); H01L 27/22 (2013.01); H01S 5/02276 (2013.01);
Abstract

A light-emitting element module includes a temperature adjustment element, a light-emitting element arranged on a temperature adjustment surface of the temperature adjustment element, a metal layer arranged on the temperature adjustment surface, a relay member arranged on the temperature adjustment surface through the metal layer, a wiring layer arranged on a surface of the relay member at an opposite side to the temperature adjustment surface, a wiring to electrically connect the light-emitting element and the wiring layer, and a wiring to electrically connect a connection electrode and the wiring layer. The wiring layer has an area smaller than an area of a region where the metal layer overlaps the relay member in a plan view.


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