The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Sep. 09, 2015
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Kuniaki Yosui, Kyoto-fu, JP;

Hiromitsu Ito, Kyoto-fu, JP;

Hiroyuki Kubo, Kyoto-fu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 7/06 (2006.01); G06K 7/10 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 1/22 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
H01Q 7/06 (2013.01); G06K 7/10336 (2013.01); G06K 19/07783 (2013.01); G06K 19/07786 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01);
Abstract

The disclosure provides an antenna device and mobile terminal including such an antenna device. The antenna device includes a coil including a conductor wound around a plate-shaped magnetic core. A flat conductor is positioned adjacent to the coil, and the coil is positioned such that it is closer than the flat conductor to an antenna of a communication partner positioned near the antenna device. The coil conductor includes a first conductor portion adjacent to a first main surface of the magnetic core and a second conductor portion adjacent to a second main surface thereof. The magnetic core and the coil conductor form an antenna coil. A circuit substrate includes a ground electrode formation area and a ground electrode non-formation area. The antenna coil is mounted on the ground electrode non-formation area of the circuit substrate with the first main surface of the magnetic core facing the circuit substrate.


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