The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Aug. 14, 2015
Applicant:

Powerchip Technology Corporation, Hsinchu, TW;

Inventors:

Shyng-Yeuan Che, Hsinchu County, TW;

Hsin-Lan Hsueh, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 28/82 (2013.01); H01L 21/28568 (2013.01); H01L 21/31144 (2013.01); H01L 21/32115 (2013.01); H01L 21/32139 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/5223 (2013.01);
Abstract

Provided is a capacitor structure including a substrate, a dielectric layer, a first conductive layer, and a cup-shaped capacitor. The dielectric layer is located on the substrate. The first conductive layer is located in the dielectric layer. The cup-shaped capacitor penetrates through the first conductive layer and is located in the dielectric layer. The cup-shaped capacitor includes a bottom electrode, a capacitor dielectric layer, and a top electrode. Two sidewalls of the bottom electrode are electrically connected to the first conductive layer. The capacitor dielectric layer covers a surface of the bottom electrode. The top electrode covers a surface of the capacitor dielectric layer. The capacitor dielectric layer is located between the top electrode and the bottom electrode. A top surface of the bottom electrode is lower than a top surface of the top electrode. Also the invention provides a method of manufacturing the capacitor structure.


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