The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Dec. 05, 2013
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Ludwig Dittmar, Dresden, DE;

Dirk Meinhold, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 27/32 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/32 (2013.01); H01L 24/05 (2013.01); H01L 27/15 (2013.01); H01L 33/62 (2013.01); H01L 51/52 (2013.01); H01L 51/5203 (2013.01); H01L 51/5218 (2013.01); H01L 51/56 (2013.01); H01L 27/3276 (2013.01); H01L 51/5234 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Various embodiments relate to an optoelectronic component including: an electronic circuit structure including an electronic circuit and a metallization structure disposed over the electronic circuit, the metallization structure including one or more contact pads electrically connected to the electronic circuit; and an optoelectronic structure disposed over the metallization structure, the optoelectronic structure including at least one electrode structure being in direct contact with the one or more contact pads, wherein the electrode structure includes an electroless plated electrically conductive material.


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