The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

May. 10, 2015
Applicant:

Semikron Elektronik Gmbh & Co., KG, Nürnberg, DE;

Inventors:

Christian Kroneder, Schwanstetten, DE;

Björn Tauscher, Abendberg, DE;

Alexej Walter, Nürnberg, DE;

Christian Göbl, Nürnberg, DE;

Harald Kobolla, Seukendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/043 (2006.01); H01L 23/29 (2006.01); H01L 23/492 (2006.01); H01L 23/40 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/34 (2013.01); H01L 23/043 (2013.01); H01L 23/296 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/492 (2013.01); H01L 23/4985 (2013.01); H01L 24/90 (2013.01); H01L 25/072 (2013.01); H01L 23/13 (2013.01); H01L 23/3735 (2013.01); H01L 23/49861 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.


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