The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Sep. 08, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventor:
Toshiyuki Kouchi, Kawasaki, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03B 1/00 (2006.01); H03K 3/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); G11C 5/14 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); G11C 5/025 (2013.01); G11C 5/063 (2013.01); G11C 5/147 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/1434 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip outputs a first signal by a first bus width and includes a first via which transfers the first signal. The second semiconductor chip receives, by the first bus width, the first signal transferred through the first via.