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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9627327 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Jul. 31, 2015

Semiconductor package and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Baik-woo Lee, Gwangmyeong, KR;

Dong-hun Lee, Hwaseong, KR;

Jae-gwon Jang, Hwaseong, KR;

Chul-yong Jang, Suwon, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., , KR;

Attorney:

Renaissance IP Law Group LLP

Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); B29C 70/78 (2006.01); B29K 63/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 24/97 (2013.01); B29C 70/78 (2013.01); B29K 2063/00 (2013.01); B29L 2009/005 (2013.01); B29L 2031/3481 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01);
Abstract

Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.

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Quick Actions:

Lee, Baik-woo. (2017). Semiconductor package and method of manufacturing the same (U.S. Patent No. 9627327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9627327

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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