The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Feb. 11, 2016
Texas Instruments Incorporated, Dallas, TX (US);
Kyle Mitchell Flessner, Lucas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A semiconductor device () comprising a leadframe with a pad () and elongated leads () made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip () attached to the pad, the chip having terminals. A metallic wire connection () from a terminal to a respective lead, the connection including a first ball bond by a first squashed ball () attached to the terminal, and a first stitch bond () attached to the lead. A second squashed ball () of the wire metal attached to the lead as a second ball bond adjacent to the first stitch bond (). A package () of a polymeric compound encapsulating the chip, wire connection, second ball and at least a portion of the elongated lead, the compound adhering to the materials of the encapsulated entities.