The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Apr. 10, 2012
Applicant:
Jeffrey Gail Holloway, Plano, TX (US);
Inventor:
Jeffrey Gail Holloway, Plano, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 21/568 (2013.01); H01L 23/4951 (2013.01); H01L 23/49558 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18165 (2013.01);
Abstract
A semiconductor package includes a metallic leadframe having a plurality of cantilever leads, a mounting area for mounting a die, and one or more non-conductive supports adjacent to a recessed surface of the cantilever leads to support the leads during die mount, wire bond, and encapsulation processes. Encapsulant encapsulates and supports at least a portion of the die, the leadframe.
Holloway, Jeffrey. (2017). Semiconductor package with cantilever leads (U.S. Patent No. 9627296). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9627296
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile