The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Mar. 30, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventor:
Shinichiro Uekusa, Kawasaki, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H01L 24/17 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H01L 23/467 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10219 (2013.01);
Abstract
A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.