The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Nov. 14, 2014
Applicant:

Hzo, Inc., Draper, UT (US);

Inventors:

Blake Stevens, Morristown, NJ (US);

Max Sorenson, Cottonwood Heights, UT (US);

Sidney Edward Martin, III, Murray, KY (US);

Assignee:

HZO, Inc., Draper, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/00 (2006.01); H01L 21/02 (2006.01); H05K 1/02 (2006.01); B05C 21/00 (2006.01); H01L 21/027 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02299 (2013.01); B05C 21/005 (2013.01); H01L 21/027 (2013.01); H01L 23/564 (2013.01); H05K 1/02 (2013.01); H05K 3/28 (2013.01); H05K 3/284 (2013.01); H01L 2924/0002 (2013.01); H05K 3/0073 (2013.01); Y10T 29/49002 (2015.01);
Abstract

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.


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