The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

May. 21, 2014
Applicant:

Delta Design, Inc., Poway, CA (US);

Inventors:

Walter James Frandsen, Jr., Ramona, CA (US);

Kexiang Ken Ding, San Diego, CA (US);

Assignee:

Delta Design, Inc., Poway, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 13/04 (2006.01); H04N 9/47 (2006.01); G06T 7/00 (2017.01); G01B 11/02 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01B 11/02 (2013.01); G01N 21/8806 (2013.01); G01N 21/95 (2013.01); G01N 21/95684 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads.


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