The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

May. 02, 2016
Applicant:

Luxtera, Inc., Carlsbad, CA (US);

Inventors:

Thierry Pinguet, Vashon, WA (US);

Sherif Abdalla, Carlsbad, CA (US);

Mark Peterson, San Diego, CA (US);

Gianlorenzo Masini, Carlsbad, CA (US);

Assignee:

Luxtera, Inc., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/06 (2006.01); H01L 29/06 (2006.01); H01L 31/00 (2006.01); H01L 21/311 (2006.01); G02B 6/42 (2006.01); H01L 21/84 (2006.01); H01L 27/06 (2006.01); H01L 27/12 (2006.01); G02B 6/34 (2006.01); G02B 6/12 (2006.01); G02F 1/225 (2006.01); H01L 25/065 (2006.01); H04B 10/27 (2013.01); G02F 1/21 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/12004 (2013.01); G02B 6/34 (2013.01); G02B 6/4295 (2013.01); G02F 1/2255 (2013.01); G02F 1/2257 (2013.01); H01L 21/84 (2013.01); H01L 25/0652 (2013.01); H01L 27/0688 (2013.01); H01L 27/1203 (2013.01); H04B 10/27 (2013.01); G02B 2006/12107 (2013.01); G02B 2006/12123 (2013.01); G02F 2001/212 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06541 (2013.01);
Abstract

Methods and systems for hybrid integration of optical communication systems may comprise in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects: receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects; receiving modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die; generating electrical signals in said silicon photonics die based on said received modulated optical signals; and communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.


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