The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Mar. 24, 2014
Applicants:

Opel Solar, Inc., Storrs Mansfield, CT (US);

The University of Connecticut, Farmington, CT (US);

Inventor:

Geoff W. Taylor, Storrs-Mansfield, CT (US);

Assignees:

THE UNIVERSITY OF CONNECTICUT, Farmington, CT (US);

Opel Solar, Inc., Storrs Mansfield, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); G02B 6/134 (2006.01); H01L 27/144 (2006.01); H01L 31/0352 (2006.01); H01S 5/042 (2006.01); H01L 29/66 (2006.01); H01L 29/74 (2006.01); H01L 21/8252 (2006.01); H01L 29/778 (2006.01); H01L 27/06 (2006.01); H01L 27/085 (2006.01); H01L 31/111 (2006.01); H01L 33/10 (2010.01); H01S 5/0625 (2006.01); H01S 5/343 (2006.01); H01S 5/062 (2006.01); H01S 5/10 (2006.01); H01S 5/20 (2006.01); H01S 5/30 (2006.01); H01S 5/22 (2006.01);
U.S. Cl.
CPC ...
G02B 6/1347 (2013.01); H01L 21/8252 (2013.01); H01L 27/0605 (2013.01); H01L 27/085 (2013.01); H01L 27/1443 (2013.01); H01L 29/66401 (2013.01); H01L 29/74 (2013.01); H01L 29/7783 (2013.01); H01L 31/035209 (2013.01); H01L 31/1113 (2013.01); H01S 5/0421 (2013.01); H01S 5/0424 (2013.01); H01S 5/1071 (2013.01); H01S 5/1075 (2013.01); H01L 29/1066 (2013.01); H01L 33/105 (2013.01); H01S 5/0625 (2013.01); H01S 5/06203 (2013.01); H01S 5/06226 (2013.01); H01S 5/1032 (2013.01); H01S 5/2027 (2013.01); H01S 5/2063 (2013.01); H01S 5/2086 (2013.01); H01S 5/222 (2013.01); H01S 5/309 (2013.01); H01S 5/34313 (2013.01);
Abstract

A semiconductor device employs an epitaxial layer arrangement including a first ohmic contact layer and first modulation doped quantum well structure disposed above the first ohmic contact layer. The first ohmic contact layer has a first doping type, and the first modulation doped quantum well structure has a modulation doped layer of a second doping type. At least one isolation ion implant region is provided that extends through the first ohmic contact layer. The at least one isolation ion implant region can include oxygen ions. The at least one isolation ion implant region can define a region that is substantially free of charge carriers in order to reduce a characteristic capacitance of the device. A variety of high performance transistor devices (e.g., HFET and BICFETs) and optoelectronic devices can employ this device structure. Other aspects of wavelength-tunable microresonantors and related semiconductor fabrication methodologies are also described and claimed.


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