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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9625136 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

Sep. 03, 2013

Light-emitting device

Applicant:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Inventors:

Kiyokazu Hino, Yokosuka, JP;

Takahiro Kurihara, Yokosuka, JP;

Assignee:

Toshiba Lighting & Technology Corporation, Yokosuka-shi, Kanagawa-ken, JP;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Elmito Breval

Int. Cl.
CPC ...
F21V 23/00 (2015.01); F21V 19/00 (2006.01); H01R 43/02 (2006.01); F21V 23/06 (2006.01); H05K 3/34 (2006.01); H01R 12/58 (2011.01); F21V 29/70 (2015.01); H05K 3/30 (2006.01); F21S 8/10 (2006.01); F21Y 101/00 (2016.01); F21Y 105/00 (2016.01); F21Y 115/30 (2016.01); F21Y 115/15 (2016.01);
U.S. Cl.
CPC ...
F21V 23/002 (2013.01); F21V 19/0025 (2013.01); F21V 23/06 (2013.01); H01R 43/0256 (2013.01); H05K 3/3447 (2013.01); F21S 48/212 (2013.01); F21S 48/232 (2013.01); F21S 48/33 (2013.01); F21V 19/003 (2013.01); F21V 19/005 (2013.01); F21V 19/0055 (2013.01); F21V 29/70 (2015.01); F21Y 2101/00 (2013.01); F21Y 2105/00 (2013.01); F21Y 2115/15 (2016.08); F21Y 2115/30 (2016.08); H01R 12/58 (2013.01); H05K 3/306 (2013.01); H05K 2201/1025 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10401 (2013.01); Y02P 70/611 (2015.11);
Abstract

A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

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