The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jun. 06, 2014
Applicant:

Yan YE, Saratoga, CA (US);

Inventor:

Yan Ye, Saratoga, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 5/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/78 (2006.01); H01L 29/66 (2006.01); C25F 7/00 (2006.01);
U.S. Cl.
CPC ...
C25F 5/00 (2013.01); C25F 7/00 (2013.01); H01L 21/3213 (2013.01); H01L 21/7806 (2013.01); H01L 29/66765 (2013.01);
Abstract

Methods and apparatuses for delaminating workpieces are provided. In one or more aspects, a method can include processing or otherwise delaminating the workpiece by separating a delamination stack and a support substrate disposed thereon. The workpiece that can include a sacrificial layer disposed between the delamination stack and the support substrate. The method can include exposing at least a portion of the workpiece to an electrolyte solution, applying an electrical current through the sacrificial layer and the electrolyte solution, selectively removing the electrically conductive or semiconductive material from the sacrificial layer during an etching process, and separating the delamination stack and the support substrate one from the other. The delamination stack can include a process piece that can be one or more wafers or devices (e.g., thin-film devices) or one or more portions of the one or more wafers or devices.


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