The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Apr. 23, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Harry W. Smith, IV, San Francisco, CA (US);

Peter F. Coxeter, Cupertino, CA (US);

Jonathan T. Mechak, Santa Clara, CA (US);

Adam L. Nekimken, Stanford, CA (US);

Julio C. Quintero, Los Gatos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 38/00 (2006.01); B29C 59/02 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0004 (2013.01); B29C 59/02 (2013.01); B32B 38/10 (2013.01); H01L 21/568 (2013.01); B32B 2317/08 (2013.01); B32B 2457/00 (2013.01); Y10T 156/1026 (2015.01); Y10T 156/12 (2015.01);
Abstract

The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.


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