The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

May. 19, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Yuji Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); C03C 17/42 (2006.01); C03C 17/245 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/42 (2006.01); C23C 14/08 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 7/12 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/30 (2013.01); B32B 27/36 (2013.01); B32B 27/42 (2013.01); C03C 17/245 (2013.01); C03C 17/42 (2013.01); C23C 14/086 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); H05K 3/007 (2013.01); H05K 2203/016 (2013.01);
Abstract

There is provided a supported resin substrate including a supporting substrate, a release layer arranged on the supporting substrate, the release layer containing a metal oxide, and a resin substrate arranged on the release layer, the resin substrate including a first surface region opposite the release layer and a second surface region in onto t with the release layer, in which the resin substrate consists essentially of a resin material having a C═O bond, and the proportion of the C═O bond present in the second surface region of the resin substrate is lower than the proportion of the C═O bond present in the first surface region of the resin substrate.


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