The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jun. 22, 2005
Applicants:

Alexander P. Mgaya, Cary, NC (US);

Balasubramaniam Ramalingam, Cary, NC (US);

Inventors:

Alexander P. Mgaya, Cary, NC (US);

Balasubramaniam Ramalingam, Cary, NC (US);

Assignee:

Henkel IP & Holding GmbH, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/40 (2006.01); B32B 27/36 (2006.01); B32B 27/32 (2006.01); B32B 27/30 (2006.01); B32B 15/08 (2006.01); B32B 7/12 (2006.01); C09J 4/00 (2006.01); B32B 27/08 (2006.01); C09J 175/16 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); C09J 4/00 (2013.01); C09J 175/16 (2013.01); B32B 2250/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/714 (2013.01); B32B 2553/00 (2013.01); Y10T 428/3158 (2015.04); Y10T 428/31551 (2015.04); Y10T 428/31565 (2015.04); Y10T 428/31587 (2015.04); Y10T 428/31605 (2015.04);
Abstract

A radiation-curable laminating adhesive is provided which contains a) at least one urethane (meth)acrylate oligomer and b) at least one additional (meth)acrylate-functionalized component selected from the group consisting of carboxylic acid-functionalized ester-containing (meth)acrylate monomers and polybutadiene poly(meth)acrylates. The adhesive may also contain other components such as (meth)acrylic polyol (meth)acrylates. Flexible packaging laminates may be obtained by using the aforedescribed adhesive to adhere thin polymeric and/or metallic films together, the adhesive being exposed to an amount of radiation effective to cure the adhesive.


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