The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Nov. 13, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Bruce Taylor, Winnipeg, CA;
Geoffrey Gibbings, Winnipeg, CA;
Rudy Braun, Winnipeg, CA;
Kyle Christopher Advent, Winnipeg, CA;
Assignee:
The Boeing Company, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/06 (2006.01); B29D 99/00 (2010.01); B32B 3/12 (2006.01); B32B 1/08 (2006.01); B32B 7/08 (2006.01); B32B 7/12 (2006.01); G10K 11/172 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29D 99/0089 (2013.01); B29D 99/0021 (2013.01); B32B 1/08 (2013.01); B32B 3/06 (2013.01); B32B 3/12 (2013.01); B32B 7/08 (2013.01); B32B 7/12 (2013.01); G10K 11/172 (2013.01); B29K 2995/0002 (2013.01); B29L 2031/7504 (2013.01); B32B 2307/102 (2013.01); B32B 2605/18 (2013.01);
Abstract
A composite component assembly may include a composite core including a plurality of core cells between first and second ends. A connection joint is formed between the first and second ends. An adhesive layer is disposed within the connection joint between the first and second ends. The adhesive layer is configured to bond the first and second ends through a curing process. A peg splice securing joint securely connects the first and second ends together before and during the curing process.