The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Dec. 12, 2013
Murata Manufacturing Co., Ltd., Kyoto, JP;
Haruhiko Mori, Kyoto, JP;
Hisashi Yoshika, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the housing holes in the carrier tape. A male die includes housing-hole formation convex portions which are constituted by a plurality of first housing-hole formation convex portions having respective tip ends at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having respective tip ends at a relatively-lower heightwise position.