logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9623527 B1

PDFFull Text
Date of Patent:
Apr. 18, 2017

Filed:

May. 06, 2011

Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions

Applicant:

Jürgen Dachs, Baar-Ebenhausen, DE;

Inventor:

Jürgen Dachs, Baar-Ebenhausen, DE;

Assignee:

OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Larry E Waggle, Jr

Assistant Examiner:

Mahdi H Nejad

Int. Cl.
CPC ...
B23Q 3/00 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
B23Q 3/00 (2013.01); H01L 21/30604 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 24/97 (2013.01); H01L 21/78 (2013.01); H01L 22/10 (2013.01); H01L 33/486 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15786 (2013.01);
Abstract

A component carrier assembly () is provided which has a plurality of component carrier regions (), which are intended for mounting semiconductor components. The component carrier assembly comprises a carrier body () with a first major face (). On the first major face a trench pattern () is formed in the carrier body, with first trenches () extending parallel to one another in a first direction, the first trenches delimiting the component carrier regions in a second direction extending transversely of the trenches. A coating () is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face () of the trench pattern which is coated at least in places.

Find Patent Forward Citations

Loading…